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Mr. Moral has worked as Electronic Packaging Engineer, Manufacturing Engineer, and R&D Engineer during his six years experience at Raltron Electronics Corp and Vectron International. While in industry he gained production experience in microelectronics packaging, microelectronics reliability, process development, CAE in packaging, and using thermo-elastic FEA for product development and failure analysis. My Student Web Page
ADDRESS Ramon J. Moral Department of Mechanical and Materials Engineering College of Engineering and Computing Florida International University 10555 West Flagler St., EC 2710, MAIDROC LAB Miami, Florida 33174 +1 (305) 348-6827 (phone) rmora022@fiu.edu (E-mail)
EDUCATION · M.S. Auburn University, (Mechanical Engineering) 1997 · B.S. Florida International University, (Mechanical Engineering) 1992
AREAS OF RESEARCH · Multiobjective Hybrid Optimization · Penetration Models · Multidisciplinary Optimization using SPH, Eulerian and Lagrangian techniques as physics models · Hypersonic panel codes
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Multidisciplinary Analysis, Inverse Design, Robust Optimization and Control Laboratory |